SUSS MicroTec Dual-Sided Position Accuracy Measurement Device DSM8Gen2
High-precision measurement of the positional deviation of patterns on the wafer surface/backside.
The DSM8/200 Gen2 is a dual-sided positioning measurement device compatible with 2 to 8-inch wafers. It is equipped with a function to eliminate TIS (tool-induced errors), achieving high-precision measurements in dual-sided patterning substrates in fields such as MEMS, power devices, and optical devices.
- Company:兼松PWS
- Price:Other